Dispensing applications in the electronics industry
Liquids and pastes are dispensed purely volumetrically and handled extremely gently. Even solids-laden and shear-sensitive adhesives can be transported without any problems. And with a repeatability of 99 % – without air inclusions! For more information about our micro dispensing systems for the electronics industry, click here.
Application examples in the electronics industry:
LED potting / LED encapsulation
Dam & fill
In dam & fill applications, the primary aim is to protect highly complex assemblies. Firstly, a high-viscosity barrier, known as the “dam”, is applied to the surface to be sealed. Then the adjacent area is filled with a filler. And the area being dosed is sealed and protected by the fluid material.
Glob-top potting is designed to protect sensitive components, usually semiconductor chips. It protects from mechanical stress such as vibrations or fluctuations in temperature. External environmental factors too, like moisture or corrosion, are thus prevented from having an impact on the potted components. This effect is realised by applying a fluid resin matrix, mostly an epoxy resin adhesive, which is then cured.
Micro dispensing refers to the dosing of fluids or pastes in volume ranges of just a few microlitres. Fields of application are, for example, bead dosing, sealing, dot dosing, potting and 2-component applications. These applications in particular call for high levels of precision, repeat accuracy and reliability.
Optical bonding is a process in which a clear adhesive is applied between the layers of glass in a touch-screen display. The main goal of this bonding process is to improve the performance of the display – for example outdoors. This procedure eliminates the gap between the glass and the display. A great deal of importance is placed on dosing precision in the field of smartphone and tablet manufacturing in particular.
Underfill applications are usually utilised with isotropic conductive adhesives. The isotropic conductive adhesive establishes the electrical connection between the microchip and the substrate. Since this adhesive is not applied over the entire surface, once it has cured (either thermally or by means of UV radiation), the hollow space needs to be refilled, or “underfilled”.